Contacto de crimpado hembra TE Connectivity 1735801, de Bronce Fosforado, sección máx. 24AWG, 0.05mm²

The wire-to-board High Performance Interconnect (HPI) connector system is available in 1.0mm, 1.25mm, 1.5mm, 2.0mm, and 2.5mm centerline pitch. This connector system ofers vertical and horizontal (right angle) connector mounting for versatility, and the square-peg technology enables product compatibility with industry standard products. TE Connectivity’s HPI products can be used anywhere a signal or low power needs to be routed through a device. If your customer’s application has more than one printed circuit board then HPI product is an option to connect the PCBs.

1.0mm – 2.5mm centerline
Vertical & Horizontal PCB Mount
Through Hole (DIP) & Surface Mount Termination (SMT)
Polarized
Partially and fully shrouded
Square termination posts
Provides design flexibility
Cost efective wire-to-board
Ensures proper compatibility of both the header and the housing
Prevents stubbing contacts
Enables inter-changeability with industry standard designs
Applications
Business & Retail Equipment
Consumer Devices
Industrial
Automotive
Medical
Appliance