- Código RS:
- 188-2808
- Referência do fabricante:
- W29N02GVBIAA
- Fabricante:
- Winbond
30 Disponível para entrega em 4 dia(s) útil(eis).
Adicionado
Preço unitário (Fornecido em múltiplos de 2)
6,53 €
Unidades | Por unidade | Por Pack* |
2 - 8 | 6,53 € | 13,06 € |
10 - 18 | 6,355 € | 12,71 € |
20 - 48 | 6,19 € | 12,38 € |
50 - 98 | 6,03 € | 12,06 € |
100 + | 5,885 € | 11,77 € |
*preço indicativo |
- Código RS:
- 188-2808
- Referência do fabricante:
- W29N02GVBIAA
- Fabricante:
- Winbond
Documentação Técnica
Legislação e Conformidade
Detalhes do produto
Density : 2Gbit (Single chip solution)
Vcc : 2.7V to 3.6V
Bus width : x8
Operating temperature
Industrial: -40°C to 85°C
Single-Level Cell (SLC) technology.
Organization
Density: 2G-bit/256M-byte
Page size
2,112 bytes (2048 + 64 bytes)
Block size
64 pages (128K + 4K bytes)
Highest Performance
Read performance (Max.)
Random read: 25us
Sequential read cycle: 25ns
Write Erase performance
Page program time: 250us(typ.)
Block erase time: 2ms(typ.)
Endurance 100,000 Erase/Program Cycles(2)
10-years data retention
Command set
Standard NAND command set
Additional command support
Sequential Cache Read
Random Cache Read
Cache Program
Copy Back
Two-plane operation
Contact Winbond for OTP feature
Contact Winbond for block Lock feature
Lowest power consumption
Read: 25mA(typ.3V)
Program/Erase: 25mA(typ.3V)
CMOS standby: 10uA(typ.)
Space Efficient Packaging
48-pin standard TSOP1
63-ball VFBGA
Vcc : 2.7V to 3.6V
Bus width : x8
Operating temperature
Industrial: -40°C to 85°C
Single-Level Cell (SLC) technology.
Organization
Density: 2G-bit/256M-byte
Page size
2,112 bytes (2048 + 64 bytes)
Block size
64 pages (128K + 4K bytes)
Highest Performance
Read performance (Max.)
Random read: 25us
Sequential read cycle: 25ns
Write Erase performance
Page program time: 250us(typ.)
Block erase time: 2ms(typ.)
Endurance 100,000 Erase/Program Cycles(2)
10-years data retention
Command set
Standard NAND command set
Additional command support
Sequential Cache Read
Random Cache Read
Cache Program
Copy Back
Two-plane operation
Contact Winbond for OTP feature
Contact Winbond for block Lock feature
Lowest power consumption
Read: 25mA(typ.3V)
Program/Erase: 25mA(typ.3V)
CMOS standby: 10uA(typ.)
Space Efficient Packaging
48-pin standard TSOP1
63-ball VFBGA
2Gb SLC NAND Flash Memory with uniform 2KB+64B page size.
Bus Width: x8
Random Read: 25us
Page Program Time: 250us(typ.)
Block Erase Time: 2ms(typ.)
Support OTP Memory Area
Random Read: 25us
Page Program Time: 250us(typ.)
Block Erase Time: 2ms(typ.)
Support OTP Memory Area
Especificações
Atributo | Valor |
---|---|
Tamaño de la Memoria | 2Gbit |
Tipo de Interfaz | Paralelo |
Tipo de Encapsulado | VFBGA |
Conteo de Pines | 63 |
Organización | 256M x 8 bit |
Tipo de Montaje | Montaje superficial |
Tipo de Célula | SLC NAND |
Tensión de Alimentación de Funcionamiento Mínima | 2.7 V |
Tensión de Alimentación Máxima de Funcionamiento | 3.6 V |
Organización de Bloques | Simétrico |
Longitud | 11.1mm |
Altura | 0.6mm |
Ancho | 9.1mm |
Dimensiones | 11.1 x 9.1 x 0.6mm |
Tiempo de Acceso Aleatorio Máximo | 25µs |
Temperatura Máxima de Funcionamiento | +85 °C |
Serie | W29N |
Número de Palabras | 256M |
Temperatura de Funcionamiento Mínima | -40 °C |
Número de Bits de Palabra | 8bit |