Memoria flash, SPI S25FS128SDSNFI101 128Mbit, 16M x 8 bit, SOIC, 8 pines

Density
S25FS128S-128 Mbits (16 MB)
S25FS256S-256 Mbits (32 MB)
Serial Peripheral Interface (SPI)
SPI Clock polarity and phase modes 0 and 3
Double Data Rate (DDR) option
Extended Addressing: 24- or 32-bit address options
Serial Command subset and footprint compatible with S25FL-A, S25FL-K, S25FL-P, and S25FL-S SPI families
Multi I/O Command subset and footprint compatible with S25FL-P, and S25FL-S SPI families
Read
Commands: Normal, Fast, Dual I/O, Quad I/O, DDR Quad
I/O
Modes: Burst Wrap, Continuous (XIP), QPI
Serial Flash Discoverable Parameters (SFDP) and Common Flash Interface (CFI), for configuration information
Program
256- or 512-byte Page Programming buffer
Program suspend and resume
Automatic ECC internal hardware Error Correction Code generation with single-bit error correction
Erase
Hybrid sector options
Physical set of eight 4-KB sectors and one 32-KB sector at the top or bottom of address space with all remaining sectors of 64 KB or
Physical set of eight 4-KB sectors and one 224-KB sector at the top or bottom of address space with all remaining sectors of 256 KB
Uniform sector options
Uniform 64-KB or 256-KB blocks for software compatibility with higher density and future devices
Erase suspend and resume
Erase status evaluation
100,000 Program-Erase Cycles, minimum
20 Year Data Retention, minimum
Security Features
One-Time Program (OTP) array of 1024 bytes
Block Protection:
Status Register bits to control protection against program or erase of a contiguous range of sectors
Hardware and software control options
Advanced Sector Protection (ASP)
Individual sector protection controlled by boot code orpassword
Option for password control of read access
Technology
Cypress 65 nm MirrorBit
® Technology with Eclipse™ Architecture
Supply Voltage
1.7V to 2.0V
Temperature Range / Grade
Industrial (-40°C to +85°C)
Industrial Plus (40°C to +105°C)
Packages (All Pb-Free)
8-lead SOIC 208 mil (SOC008) — FS128S only
WSON 6  5 mm (WND008) — FS128S only
WSON 6  8 mm (WNH008)
16-lead SOIC 300 mil (SO3016 — FS256S only)
BGA-24 6  8 mm
5  5 ball (FAB024) footprint
4  6 ball (FAC024) footprint
Known Good Die, and Known Tested Die